Title :
A 3D HDI ASP: a cost-effective alternative to WSI signal processors
Author :
Warren, K.D. ; Reche, J.H. ; Jacobi, W.J. ; Lea, R.M.
Author_Institution :
Brunel Univ., Uxbridge, UK
Abstract :
A research project, in which various high-density interconnect (HDI) and wafer-scale integration (WSI) implementation variants of a common computer architecture, the associative string processor (ASP), are compared, is discussed. The ASP is a fault-tolerant and highly versatile massively parallel processor capable of sustaining high performance over a wide range of computationally intensive tasks and, unlike most other computer architectures, the ASP has been designed to exploit state-of-the-art microelectronic technology. The study indicates that, until the feasibility of WSI ASP technology has been proven, a 3-D HDI ASP seems to offer a cost-effective alternative technology for the development of highly compact massively parallel processors for aerospace and automotive applications
Keywords :
VLSI; computer architecture; digital signal processing chips; parallel processing; 3-D HDI ASP; associative string processor; computer architectures; high-density interconnect; massively parallel processor; wafer-scale integration; Application specific processors; Assembly; Ceramics; Collaboration; Computer architecture; Concurrent computing; Microelectronics; Signal processing; Substrates; Ultra large scale integration;
Conference_Titel :
Wafer Scale Integration, 1989. Proceedings., [1st] International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-8186-9901-9
DOI :
10.1109/WAFER.1989.47557