• DocumentCode
    241908
  • Title

    Impact of N plasma treatment on the Current collapse of ALGAN/GAN HEMTs

  • Author

    Zhihua Dong ; Ronghui Hao ; Zhili Zhang ; Yong Cai ; Baoshun Zhang ; Zhiqun Cheng

  • Author_Institution
    Sch. of Electron. & Inf., Hangzhou Dianzi Univ., Hangzhou, China
  • fYear
    2014
  • fDate
    28-31 Oct. 2014
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    The impact of N- plasma treatment before SiNx deposition on current collapse of AlGaN/GaN HEMTs was studied. N- plasma treatment of 1, 2 and 5 minutes was performed before SiNx deposition with plasma enhanced chemical vapor deposition (PECVD). It is found current collapse changed with three kinds of schemes. Apparent differences occurred with treatment time. The Current lags of the sample with treatment of 1 minute degenerated to 65.45%, compared with the current lag without any N- plasma treatment and passivation. While the value of the samples with treatment of 2 and 5 minutes changed to 58.11% and 30.44%, indicating N- plasma treatment before SiNx passivation is benefit to depress current collapse. The reason is suggested to be the N- plasma treatment caused reduction of interface states, which is probably originate from some kind of defects related nitrogen.
  • Keywords
    III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; passivation; plasma CVD; silicon compounds; wide band gap semiconductors; AlGaN-GaN; HEMT; N- plasma passivation; N- plasma treatment; PECVD; SiNx; SiNx deposition; SiNx passivation; current collapse; current lags; plasma enhanced chemical vapor deposition; Abstracts; Aluminum gallium nitride; Current measurement; Educational institutions; Gallium nitride; HEMTs; MODFETs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4799-3296-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2014.7021380
  • Filename
    7021380