DocumentCode
2420064
Title
Fabrication of a Complicated Heat Transfer Microchannel System for CPU Cooling Study
Author
Chen, H.T. ; Liu, C.W. ; Liu, S.G. ; Yang, C.S. ; Gau, C.
Author_Institution
Inst. of Aeronaut. & Astronaut., National Cheng Kung Univ.
fYear
2007
fDate
16-19 Jan. 2007
Firstpage
654
Lastpage
658
Abstract
Fabrication of a temperature sensor array and a heater in a complicated heat transfer microchannel system, on a glass substrate, is presented. In addition to the glass substrate, low thermal conductivity materials such as SU-8, PMMA plate are selected to form the micro channel wall to provide good thermal insulation. Both the titanium and the platinum are deposited sequentially on a glass plate and made into heater and sensors, respectively. Lift-off method is used to obtain the desired pattern for heater and sensors. The fabrication process is much simpler than those reported in literature. Design consideration and fabrication techniques involved in this processes is discussed. Finally, validation of the heaters and sensors fabricated and a measurement of the heat transfer coefficient distributions inside the micro channel is presented.
Keywords
cooling; glass; heat systems; heating; microchannel flow; sensor arrays; temperature sensors; CPU cooling; MEMS fabrication; Pt; Ti; glass substrate; heat transfer coefficient distribution; heat transfer microchannel system; heater; lift-off method; low thermal conductivity materials; micro scale heat transfer; microfluidics; temperature sensor array; thermal insulation; Conducting materials; Cooling; Fabrication; Glass; Heat transfer; Microchannel; Sensor arrays; Temperature sensors; Thermal conductivity; Thermal sensors; MEMS fabrication; micro scale heat transfer; microchannel; microfluidics;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems, 2007. NEMS '07. 2nd IEEE International Conference on
Conference_Location
Bangkok
Print_ISBN
1-4244-0610-2
Type
conf
DOI
10.1109/NEMS.2007.352104
Filename
4160407
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