Title :
Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507)
Abstract :
The following topics were dealt with: adhesives; integrated passives; underfills; encapsulation; flip chip bumping; solder; chip scale packages; high density substrates; thermomechanical effects
Keywords :
adhesives; encapsulation; flip-chip devices; packaging; soldering; adhesives; advanced packaging materials; chip scale packages; encapsulation; flip chip bumping; high density substrates; integrated passives; solder; thermomechanical effects; underfills;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on
Conference_Location :
Braselton, GA, USA
Print_ISBN :
0-930815-59-9
DOI :
10.1109/ISAPM.2000.869233
