DocumentCode
2421609
Title
Microstructure Fabrication with Conductive Paste Dispensing
Author
Itoh, Toshihiro ; Suga, Tadatomo ; Kataoka, Kenichi ; Sano, Toshio
Author_Institution
Dept. of Precision Eng., Tokyo Univ.
fYear
2007
fDate
16-19 Jan. 2007
Firstpage
1003
Lastpage
1007
Abstract
We report on a fabrication technique that realizes 3-dimensionaI microstructures made of conductive pastes and mechanical and electrical properties of the fabricated microstructures. In the technique, ultra precise dispensing of low-temperature silver pastes on a heated substrate is continuously repeated and variable microstructures with a diameter of as small as 20 micrometers such as high posts, cantilevers and zigzag shapes can be successfully fabricated. The mechanical and electrical properties of the fabricated microcantilevers have been investigated and it has been found that their probing resistance with a low contact force of 1 mN can be lower than 1 Omega by utilizing appropriate heat curing and fritting processes.
Keywords
cantilevers; conductive adhesives; electric properties; mechanical properties; micromechanical devices; silver; 3D microstructures; Ag; conductive paste dispensing; electrical properties; fritting process; heat curing process; mechanical properties; microcantilevers; microstructure fabrication; silver pastes; Contacts; Fabrication; Integrated circuit interconnections; Integrated circuit packaging; Microstructure; Probes; Silver; Springs; Substrates; Testing; MEMS packaging; conductive paste; dispensing; fritting; microspring;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems, 2007. NEMS '07. 2nd IEEE International Conference on
Conference_Location
Bangkok
Print_ISBN
1-4244-0610-2
Type
conf
DOI
10.1109/NEMS.2007.352187
Filename
4160490
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