• DocumentCode
    2421609
  • Title

    Microstructure Fabrication with Conductive Paste Dispensing

  • Author

    Itoh, Toshihiro ; Suga, Tadatomo ; Kataoka, Kenichi ; Sano, Toshio

  • Author_Institution
    Dept. of Precision Eng., Tokyo Univ.
  • fYear
    2007
  • fDate
    16-19 Jan. 2007
  • Firstpage
    1003
  • Lastpage
    1007
  • Abstract
    We report on a fabrication technique that realizes 3-dimensionaI microstructures made of conductive pastes and mechanical and electrical properties of the fabricated microstructures. In the technique, ultra precise dispensing of low-temperature silver pastes on a heated substrate is continuously repeated and variable microstructures with a diameter of as small as 20 micrometers such as high posts, cantilevers and zigzag shapes can be successfully fabricated. The mechanical and electrical properties of the fabricated microcantilevers have been investigated and it has been found that their probing resistance with a low contact force of 1 mN can be lower than 1 Omega by utilizing appropriate heat curing and fritting processes.
  • Keywords
    cantilevers; conductive adhesives; electric properties; mechanical properties; micromechanical devices; silver; 3D microstructures; Ag; conductive paste dispensing; electrical properties; fritting process; heat curing process; mechanical properties; microcantilevers; microstructure fabrication; silver pastes; Contacts; Fabrication; Integrated circuit interconnections; Integrated circuit packaging; Microstructure; Probes; Silver; Springs; Substrates; Testing; MEMS packaging; conductive paste; dispensing; fritting; microspring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2007. NEMS '07. 2nd IEEE International Conference on
  • Conference_Location
    Bangkok
  • Print_ISBN
    1-4244-0610-2
  • Type

    conf

  • DOI
    10.1109/NEMS.2007.352187
  • Filename
    4160490