Title :
High Temperature Attenuation and Modulus Measurements
Author :
Chen, J.N.C. ; Papadakis, E.P. ; Carnevale, E.H. ; Carey, C.A.
Keywords :
Absorption; Attenuation measurement; Copper; Frequency; Grain boundaries; Microstructure; Silver; Temperature distribution; Vibrations; Wire;
Conference_Titel :
1974 Ultrasonics Symposium
DOI :
10.1109/ULTSYM.1974.196394
