DocumentCode :
242468
Title :
Failure analysis of a bipolar integrated circuit
Author :
Sheng Xing ; Peng Kewu ; Zhang Zhengyuan ; Liu Luncai ; Liu Fan ; Wu Lina
Author_Institution :
Sichuan Inst. of Solid-State Circuits, Chongqing, China
fYear :
2014
fDate :
28-31 Oct. 2014
Firstpage :
1
Lastpage :
3
Abstract :
The research of failure analysis for integrated circuits can improve the reliability. Based on one failed circuit, do the analysis which including electrical parameter test, chip surface check, schematic diagram and layout analysis, and find the failure reason, then use simulation to verify the analized conclusion. Finally, throw out some effective ways to avoid this kind of failure that might happen again, which is helpful for improving the reliability of integrated circuits.
Keywords :
bipolar integrated circuits; failure analysis; integrated circuit layout; integrated circuit reliability; integrated circuit testing; bipolar integrated circuit; chip surface check; eletrical parameter testing; failure analysis; layout analysis; reliability; schematic diagram; Abstracts; Electron tubes; Gain; Integrated circuit reliability; Pins; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4799-3296-2
Type :
conf
DOI :
10.1109/ICSICT.2014.7021658
Filename :
7021658
Link To Document :
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