Title :
Gate oxide reliability of drain-side stresses compared to gate stresses
Author :
Dumin, Nels A. ; Liu, Kaiping ; Yang, Shyh-Homg
Author_Institution :
Silicon Technol. Dev., Texas Instrum. Inc., Dallas, TX, USA
Abstract :
The gate oxide breakdown voltages of stresses applied to the gates of transistors are compared to the gate oxide breakdown voltages of stresses applied to the drains of transistors. The breakdown voltages for the drain-side stress are shown to be higher than the breakdown voltages for the gate stress. Using TCAD simulation data of a drain-side stress, the differences in breakdown voltages between the drain stresses and the gate stresses are compared to predictions of the gate oxide lifetime for various gate-stress and drain-stress cases.
Keywords :
MOSFET; insulating thin films; semiconductor device breakdown; semiconductor device models; semiconductor device reliability; technology CAD (electronics); MOS transistor; TCAD simulation data; drain-side stresses; gate oxide breakdown voltages; gate oxide lifetime; gate oxide reliability; gate stresses; Circuits; Instruments; MOSFETs; Predictive models; Silicon; Stress; Voltage;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2002. 40th Annual
Print_ISBN :
0-7803-7352-9
DOI :
10.1109/RELPHY.2002.996612