• DocumentCode
    2426403
  • Title

    Hermeticity and stiction in MEMS packaging

  • Author

    Jacobs, S.Joshua ; Miller, Seth A. ; Malone, Joshua J. ; McDonald, William C. ; Lopes, Vincent C. ; Magel, Lissa K.

  • Author_Institution
    DLP Products, Texas Instrum. Inc., Dallas, TX, USA
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    136
  • Lastpage
    139
  • Abstract
    Exposure of operating MEMS structures to atmospheric gasses may have deleterious effects on device performance. Here we consider from a phenomenological point of view the effects that moisture has on both short- and long-term performance characteristics of Texas Instruments´ Digital Micromirror Device (DMD). As an array of up to 1.3 million mirrors, a single DMD can provide a wealth of statistical information; compilations of device statistics provide thorough descriptions of effects that may be obtained through static or operational aging with a variety of package environments. The detection sensitivity of our test methods provides significant insight into the global and local effects of package environment, including the effects of water on device operation.
  • Keywords
    ageing; micro-optics; micromechanical devices; mirrors; moisture; seals (stoppers); semiconductor device packaging; semiconductor device reliability; statistical analysis; stiction; MEMS packaging; atmospheric gasses; detection sensitivity; device statistics; digital micromirror device; global effects; hermeticity; local effects; long-term performance; moisture; operational aging; package environments; phenomenological effects; short-term performance; static aging; statistical information; stiction; Adhesives; Jacobian matrices; Magnesium compounds; Microelectromechanical devices; Micromechanical devices; Micromirrors; Mirrors; Moisture; Packaging; Production;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium Proceedings, 2002. 40th Annual
  • Print_ISBN
    0-7803-7352-9
  • Type

    conf

  • DOI
    10.1109/RELPHY.2002.996625
  • Filename
    996625