DocumentCode :
2427011
Title :
Simulation of interchip interconnections based on resonant cavity LEDs, plastic optical fibres and CMOS interface circuits
Author :
Bockstaele, R. ; Baets, R.
Author_Institution :
Dept. of Inf. Technol., Ghent Univ., Belgium
fYear :
2000
fDate :
24-28 July 2000
Abstract :
This paper presents a LabView-based interchip electro-optical parallel interconnect simulator. Such links are a possible solution for the interconnect bottleneck in future digital systems. The links and their characteristics are quite different from the traditional long distance optical links: the components should be small, low-cost, temperature-insensitive and simple; and the latency (the overall signal delay) and power dissipation must be kept under control. This simulator focuses in particular on the modelling of the resonant cavity LED and the performance analysis.
Keywords :
CMOS integrated circuits; driver circuits; light emitting diodes; optical interconnections; optical links; optical receivers; telecommunication computing; CMOS integrated drivers; CMOS interface circuits; LabView-based simulator; electro-optical parallel interconnect simulator; eye diagram; interchip interconnections; interconnect bottleneck; latency; modelling; optical receiver; performance analysis; plastic optical fibres; power dissipation; resonant cavity LED; Analytical models; Delay; Digital systems; Optical control; Optical fiber communication; Power dissipation; Power system interconnection; Power system modeling; Resonance; Temperature control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic-Enhanced Optics, Optical Sensing in Semiconductor Manufacturing, Electro-Optics in Space, Broadband Optical Networks, 2000. Digest of the LEOS Summer Topical Meetings
Conference_Location :
Aventura, FL, USA
ISSN :
1099-4742
Print_ISBN :
0-7803-6252-7
Type :
conf
DOI :
10.1109/LEOSST.2000.869689
Filename :
869689
Link To Document :
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