• DocumentCode
    2428124
  • Title

    The packaging effect on high g accelerometer test

  • Author

    Shi, Yunbo ; Zhu, Zhengqiang ; Li, Ping ; Liu, Jun

  • Author_Institution
    Nat. Key Lab. for Electron. Meas. Technol., Taiyuan, China
  • fYear
    2010
  • fDate
    20-23 Jan. 2010
  • Firstpage
    720
  • Lastpage
    722
  • Abstract
    To address the high-g acceleration sensor packaging material and structure selection issue; the modal frequency of different packaging materials was analyzed. According to the natural frequencies, ceramic and stainless steel selected as two package forms. Then, test of the two types of package was processed by Hopkinson bar. The experimental results show that, the sensitivity decreased and the structural stability was good while sensor packaged by stainless steel. The experimental results also show that the sensor has good sensitivity and anti-overload ability. The output single is right when the structure impacted by 150000g. The anti-overload ability was bad of ceramic package structure and easy to produce resonant phenomenon, but sensitivity was higher than the stainless steel packaged sensor.
  • Keywords
    accelerometers; ceramics; electronics packaging; microsensors; stainless steel; Hopkinson bar; antioverload ability; ceramic package structure; high g accelerometer test; high-g acceleration sensor packaging material; modal frequency; natural frequencies; packaging effect; resonant phenomenon; stainless steel; structural stability; High g acceleration sensor; Modal frequency; Sensor packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2010 5th IEEE International Conference on
  • Conference_Location
    Xiamen
  • Print_ISBN
    978-1-4244-6543-9
  • Type

    conf

  • DOI
    10.1109/NEMS.2010.5592255
  • Filename
    5592255