DocumentCode
2428685
Title
Comparison of Test Methods for High Performance Thermal Interface Materials
Author
Jarrett, R.N. ; Merritt, C.K. ; Ross, J.P. ; Hisert, J.
Author_Institution
Indium Corp. of America, Clinton, NY
fYear
2007
fDate
18-22 March 2007
Firstpage
83
Lastpage
86
Abstract
This paper relates the application of two of the methods for testing the thermal interface materials to the development and characterization of high performance materials. Particular strengths of different test methods provide a more complete understanding of TIM performance. In combination the tools provide effective development and improvement metrics. The limitations in resolution and repeatability are discussed.
Keywords
materials testing; thermal management (packaging); ASTM D5470; TIM testing; thermal interface materials; thermal test vehicle; Clamps; Heat sinks; Materials testing; Resistance heating; Steady-state; Surface resistance; Temperature sensors; Thermal force; Thermal resistance; Vehicles; ASTM D5470; TIM testing; thermal test vehicle;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2007. SEMI-THERM 2007. Twenty Third Annual IEEE
Conference_Location
San Jose, CA
ISSN
1065-2221
Print_ISBN
1-4244-09589-4
Electronic_ISBN
1065-2221
Type
conf
DOI
10.1109/STHERM.2007.352391
Filename
4160892
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