Title :
Thermal Management of High Density Very Low Profile Memory Module
Author :
Ran, Hongyu ; Mohammed, Ilyas
Author_Institution :
Tessera, Inc., San Jose, CA
Abstract :
Thermal analysis is conducted on high density memory modules with 4 stack DDR2 package. Two interconnect technologies, ball stack and micro contact, are compared. Due to the high power density and limited space, thermal management of the modules is challenging. Limitation of conventional air cooling is discussed, and innovative cooling schemes are demonstrated.
Keywords :
random-access storage; thermal analysis; thermal management (packaging); ball stack; conventional air cooling; high density very low profile memory module; micro contact; thermal analysis; thermal management; Communication system control; Cooling; Memory management; Packaging; Random access memory; Space technology; Temperature; Thermal conductivity; Thermal management; Thermal resistance; DRAM; FB-DIMM; RDIMM; ball stack; micro contact;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2007. SEMI-THERM 2007. Twenty Third Annual IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
1-4244-09589-4
Electronic_ISBN :
1065-2221
DOI :
10.1109/STHERM.2007.352410
