DocumentCode
2428890
Title
Spray Cooling with Mixtures of Dielectric Fluids
Author
Ashwood, Andrea C. ; Shedd, Timothy A.
Author_Institution
Dept. of Mech. Eng., Wisconsin-Madison Univ., Madison, WI
fYear
2007
fDate
18-22 March 2007
Firstpage
144
Lastpage
148
Abstract
Spray cooling is one technology with the potential to help solve the thermal management issues of future generations of electronics. To date, however, its implementation has been limited by the lack of understanding of how spray cooling systems can be engineered rather than designed by trial and error. This work presents a comprehensive set of heat transfer data for single- and four-nozzle spray arrays using 5 different pure fluids and mixtures of pairs of these 5. Importantly, it was found that the heat transfer performance of the mixtures was not impaired as is often the case in convective flow boiling. In addition, a single correlation is presented that predicts all of the data to within 9% mean average error.
Keywords
cooling; sprays; thermal management (packaging); dielectric fluids; heat transfer data; spray cooling; thermal management; Dielectric liquids; Dielectric thin films; Electronics cooling; Fluid flow measurement; Heat transfer; Liquid cooling; Pumps; Temperature sensors; Thermal management of electronics; Thermal spraying;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2007. SEMI-THERM 2007. Twenty Third Annual IEEE
Conference_Location
San Jose, CA
ISSN
1065-2221
Print_ISBN
1-4244-09589-4
Electronic_ISBN
1065-2221
Type
conf
DOI
10.1109/STHERM.2007.352414
Filename
4160902
Link To Document