• DocumentCode
    2428890
  • Title

    Spray Cooling with Mixtures of Dielectric Fluids

  • Author

    Ashwood, Andrea C. ; Shedd, Timothy A.

  • Author_Institution
    Dept. of Mech. Eng., Wisconsin-Madison Univ., Madison, WI
  • fYear
    2007
  • fDate
    18-22 March 2007
  • Firstpage
    144
  • Lastpage
    148
  • Abstract
    Spray cooling is one technology with the potential to help solve the thermal management issues of future generations of electronics. To date, however, its implementation has been limited by the lack of understanding of how spray cooling systems can be engineered rather than designed by trial and error. This work presents a comprehensive set of heat transfer data for single- and four-nozzle spray arrays using 5 different pure fluids and mixtures of pairs of these 5. Importantly, it was found that the heat transfer performance of the mixtures was not impaired as is often the case in convective flow boiling. In addition, a single correlation is presented that predicts all of the data to within 9% mean average error.
  • Keywords
    cooling; sprays; thermal management (packaging); dielectric fluids; heat transfer data; spray cooling; thermal management; Dielectric liquids; Dielectric thin films; Electronics cooling; Fluid flow measurement; Heat transfer; Liquid cooling; Pumps; Temperature sensors; Thermal management of electronics; Thermal spraying;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2007. SEMI-THERM 2007. Twenty Third Annual IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Print_ISBN
    1-4244-09589-4
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/STHERM.2007.352414
  • Filename
    4160902