Title :
Glass carrier SOP technology demonstrated by design of a 19 GHz 3.8 dB CMOS LNA
Author :
Aspemyr, Lars ; Sjöland, Henrik ; Berthiot, Denis ; Proot, Jean-Pierre
Author_Institution :
Ericsson AB, Sweden
Abstract :
To demonstrate the capability of the System-on-Package concept for microwave design a 19 GHz low-power, low-noise amplifier in 0.13 mum CMOS is manufactured. A CMOS chip is flip-chip mounted on a glass carrier with integrated passive components. The LNA has a power gain of 7 dB, a 3.8 dB noise figure, and a IP1dB of -5.8 dBm at 19.2 GHz. The LNA consumes 5 mA from a 1.2 V supply.
Keywords :
CMOS analogue integrated circuits; field effect MIMIC; flip-chip devices; integrated circuit design; low noise amplifiers; low-power electronics; system-on-package; CMOS chip; SOP; current 5 mA; flip-chip mounting; frequency 19 GHz; frequency 19.2 GHz; gain 7 dB; glass carrier; integrated passive components; low-noise amplifier; low-power amplifier; noise figure 3.8 dB; power gain; size 0.13 mum; system-on-package; voltage 1.2 V; CMOS process; CMOS technology; Capacitors; Costs; Fabrication; Glass; Impedance matching; Inductors; Packaging; Radio frequency; BCB; LNA; SOP;
Conference_Titel :
VLSI Design, Automation and Test, 2009. VLSI-DAT '09. International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
978-1-4244-2781-9
Electronic_ISBN :
978-1-4244-2782-6
DOI :
10.1109/VDAT.2009.5158101
