Title :
Microchannel cooling of traveling-wave-tube circuit for ultrawideband high-power submillimeter-wave generation
Author :
Ma, Yanbao ; Bhunia, Avijit ; Field, Mark ; Chen, Chung-Lung
Author_Institution :
Sch. of Eng., Univ. of California at Merced, Merced, CA, USA
Abstract :
High heat dissipation is generated in Traveling-wave-tube circuit for ultrawideband high-power submillimeter-wave generation due to e-beam power loss during transport. Active cooling is required to ensure the device can physically handle the high heat flux without damage. An efficient thermal management solution is provided for cooling the high-power vacuum device based on microchannel technology. A thermal conduction model is developed in Ansys Workbench® to calculate thermal resistance in the vacuum device while a conjugated thermal conduction and convection model is developed in Fluent for the design of microchannel heat sink. The performance of microchannel heat sink is investigated to ensure a safe operational condition (maximum temperatures 250 °C) for the high-power vacuum device with 95% e-beam transport efficiency.
Keywords :
cooling; heat sinks; microchannel flow; submillimetre wave devices; submillimetre wave generation; thermal management (packaging); travelling wave tubes; active cooling; electron beam power loss; high heat flux; high power vacuum device; microchannel cooling; microchannel heat sink; microchannel technology; thermal management; thermal resistance; traveling wave tube circuit; ultrawideband high power submillimeter wave generation; High frequency vacuum electronics; Microchannel cooling; Microfluidic; heat sink; numerical simulation;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2010 5th IEEE International Conference on
Conference_Location :
Xiamen
Print_ISBN :
978-1-4244-6543-9
DOI :
10.1109/NEMS.2010.5592436
