Title :
Proceedings of 1994 IEEE International Integrated Reliability Workshop (IRWS)
Abstract :
The following topics were dealt with: wafer level reliability and building in reliability; reliability modeling and simulation; mobile ion contamination; dielectric integrity testing; IC package reliability
Keywords :
integrated circuit packaging; integrated circuit reliability; reliability theory; semiconductor device reliability; semiconductor process modelling; IC package reliability; built-in reliability; dielectric integrity testing; integrated reliability; mobile ion contamination; reliability modeling; reliability simulation; wafer level reliability;
Conference_Titel :
Integrated Reliability Workshop, 1994. Final Report., 1994 International
Conference_Location :
Lake Tahoe, CA, USA
Print_ISBN :
0-7803-1908-7
DOI :
10.1109/IRWS.1994.515816
