• DocumentCode
    24338
  • Title

    nMOS Short Channel Device Characteristics After Soft Oxide Breakdown and Implications for Reliability Projections and Circuits

  • Author

    Nicollian, Paul E. ; Min Chen ; Yang Yang ; Chancellor, Cathy A. ; Reddy, Viswanath K.

  • Author_Institution
    Texas Instrum., Dallas, TX, USA
  • Volume
    61
  • Issue
    1
  • fYear
    2014
  • fDate
    Jan. 2014
  • Firstpage
    66
  • Lastpage
    72
  • Abstract
    The currents in all N-channel field effect transistor device terminals can be severely degraded when a soft breakdown event occurs from gate-to-drain. These effects become more pronounced for shorter channel lengths. We present a methodology for separating the effects of mobility degradation and threshold voltage shift on post breakdown device characteristics. Using an accurate equivalent circuit model, we analyze the impact of these parameter shifts on post breakdown circuit performance and the implications for post breakdown reliability projections and circuit design.
  • Keywords
    MOSFET; equivalent circuits; semiconductor device breakdown; semiconductor device reliability; N-channel field effect transistor device terminals; circuit design; equivalent circuit; mobility degradation; nMOS short channel device characteristics; reliability projections; soft oxide breakdown; threshold voltage shift; Degradation; Delays; Electric breakdown; Integrated circuit modeling; Integrated circuit reliability; Logic gates; Breakdown; SiON; dielectric; oxide; reliability; time-dependent-dielectric-breakdown (TDDB);
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2013.2292551
  • Filename
    6683066