• DocumentCode
    2434286
  • Title

    Study on quartz tuning fork resonator as micro temperature

  • Author

    Ma, Jing ; You, Bo ; Xu, Jun

  • Author_Institution
    Sch. of Meas.-Control Tech & Commun. Eng., Harbin Univ. of Sci. & Technol., Harbin, China
  • fYear
    2010
  • fDate
    20-23 Jan. 2010
  • Firstpage
    1102
  • Lastpage
    1105
  • Abstract
    A miniature digital temperature sensor with the ZY cut quartz crystal tuning fork resonators was developed. The quartz crystal tuning fork resonators have the characteristic that the resonance frequency changes by the external temperature, which achieves high sensitivity and high-speed response and frequency stability by a sample structure. The quartz crystal tuning fork resonators are square cross section tuning forks whose arms are vibrating in flexure-mode with clamped-free boundary conditions. We designed and analyzed the thermo characteristics of the quartz crystal tuning fork resonator by theory and finite element method. The design and implement of a FPGA-based frequency measurement system for quartz crystal tuning fork temperature sensor is proposed. Using different design technique a bandwidth of 40 MHz and a resolution of 0.02 Hz is achieved. The experimental results shown that a temperature accuracy of 0.05 °C and a resolution of 0.02 °C within temperature range from -10 °C to 150°C.
  • Keywords
    crystal resonators; field programmable gate arrays; finite element analysis; frequency measurement; frequency stability; microsensors; sensitivity; temperature sensors; vibrations; FPGA; bandwidth 40 MHz; clamped-free boundary conditions; digital temperature microsensor; finite element method; frequency measurement; frequency stability; quartz crystal; sensitivity; temperature 0.02 degC; temperature 0.05 degC; tuning fork resonators; Temperature sensor; flexural-mode; quartz sensor; tuning fork resonator;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2010 5th IEEE International Conference on
  • Conference_Location
    Xiamen
  • Print_ISBN
    978-1-4244-6543-9
  • Type

    conf

  • DOI
    10.1109/NEMS.2010.5592555
  • Filename
    5592555