Title :
A scalable thermal mechanical test chip for package characterization and qualifications
Author :
Duffalo, Joseph M. ; Domer, Steven M. ; Hollstein, Roger L. ; Hullinger, Alan K. ; Niederkorn, Andrea J. ; Wecker, Nola J.
Author_Institution :
Appl. Specific Integrated Circuits Div., Motorola Inc., Chandler, AZ, USA
Abstract :
A thermal mechanical test chip (TMTC) has been designed to reduce the cycle time and cost of package reliability qualifications. The TMTC moves package reliability assessment closer to the package and assembly development cycle by breaking the tie between silicon qualification and package qualification. This approach comprehensively addresses both the mechanical and the thermal reliability issues of package assembly without the added design and manufacturing costs of a full flow silicon test chip
Keywords :
integrated circuit packaging; integrated circuit reliability; integrated circuit testing; production testing; cycle time; mechanical reliability issues; package assembly; package characterization; package qualification; package reliability; reliability assessment; scalable thermal mechanical test chip; thermal reliability issues; Application specific integrated circuits; Assembly; Circuit testing; Costs; Integrated circuit packaging; Integrated circuit reliability; Qualifications; Silicon; Stress; Vehicles;
Conference_Titel :
Integrated Reliability Workshop, 1994. Final Report., 1994 International
Conference_Location :
Lake Tahoe, CA
Print_ISBN :
0-7803-1908-7
DOI :
10.1109/IRWS.1994.515825
