Thermal issues in microelectronics [breaker page]

fYear

2012

fDate

24-26 May 2012

Firstpage

295

Lastpage

296

Abstract

Start of the Thermal issues in microelectronics section.

fLanguage

English

Publisher

ieee

Conference_Titel

Mixed Design of Integrated Circuits and Systems (MIXDES), 2012 Proceedings of the 19th International Conference

Conference_Location

Warsaw, Poland

Print_ISBN

978-1-4577-2092-5

Type

conf

Filename

6226295

Link To Document