Title :
Nonlinear vibration analysis of ultrasonic horn model for flip-chip bonding
Author :
Lee, Sao Il ; Hong, Sang Hyuk
Author_Institution :
Univ. of Seoul, Seoul
Abstract :
A simple model has been developed and analyzed capturing the main dynamic features in longitudinal flip-chip bonding. The ultrasonic horn is modeled as a longitudinal rod with the contact conditions after verifying the modal characteristics by using finite element analysis. The MATLAB simulation is performed for the simplified equation of motion of the horn model and the results show the nonlinear vibration effects in the flip-chip bonding process.
Keywords :
finite element analysis; flip-chip devices; ultrasonic bonding; vibrations; MATLAB simulation; finite element analysis; lead-free bonding; longitudinal flip-chip bonding; longitudinal rod; modal characteristics; nonlinear vibration analysis; ultrasonic horn model; Aerodynamics; Bonding processes; Electronic mail; Finite element methods; Frequency; MATLAB; Mathematical model; Nonlinear equations; Shape; Vibrations; Flip-chip bonding; Nonlinear analysis; Ultrasonic horn;
Conference_Titel :
Control, Automation and Systems, 2007. ICCAS '07. International Conference on
Conference_Location :
Seoul
Print_ISBN :
978-89-950038-6-2
Electronic_ISBN :
978-89-950038-6-2
DOI :
10.1109/ICCAS.2007.4406846
