DocumentCode
2437704
Title
Wafer Level Reliability Utilization and Trends
Author
Achee, Ehren T.
fYear
1994
fDate
16-19 Oct 1994
Firstpage
139
Keywords
Condition monitoring; Data engineering; Decision making; Electronics industry; Failure analysis; Fuses; Packaging; Semiconductor device reliability; Semiconductor device testing; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop, 1994. Final Report., 1994 International
Print_ISBN
0-7803-1908-7
Type
conf
DOI
10.1109/IRWS.1994.515842
Filename
515842
Link To Document