• DocumentCode
    2439420
  • Title

    DC corona in SE/sub 6/: evidence of an electronic component for the negative polarity

  • Author

    Fréchette, M.F. ; Kamel, S.I.

  • Author_Institution
    Cables et Isolation Interne, Inst. de Recherche d´´Hydro-Quebec, Varennes, Que., Canada
  • fYear
    1988
  • fDate
    5-8 June 1988
  • Firstpage
    73
  • Lastpage
    76
  • Abstract
    Current-voltage characteristics of corona discharge properties in SF/sub 6/ have been investigated using a point-to-plane geometry. The hemispherical tip of the rod is 1 mm in diameter and the gas pressures are typically low (from 13.3 to 40 kPa). The measured ratio of the negative to the positive ion mobility varies with the gap length, converging as the point-to-plane distance increases (up to 7 cm for the lowest pressure). At short gap (<10 mm) and for the negative polarity, the measured current exceeds the saturation-current limit (unipolar) over a substantial voltage range before breakdown; the variation of the square root of the corona current is found to be linear with the applied voltage. The above observations are supporting evidence for an electronic component at small distance for the negative-polarity case. The estimated electronic contribution to the total current decreases with increasing gap length and pressure.<>
  • Keywords
    corona; gaseous insulation; spark gaps; sulphur compounds; 0 to 7 cm; 1 mm; 13.3 to 40 kPa; DC corona; SF/sub 6/; corona current; corona discharge properties; electronic component at small distance; fast electrons contribution to conduction; gap length; gas pressures; hemispherical tip; measured current; negative ion mobility; negative polarity; point-to-plane distance; point-to-plane geometry; positive ion mobility; saturation-current limit; Corona; Current measurement; Current-voltage characteristics; Electrodes; Electronic components; Geometry; Steel; Sulfur hexafluoride; Tungsten; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 1988., Conference Record of the 1988 IEEE International Symposium on
  • Conference_Location
    Cambridge, MA, USA
  • ISSN
    1089-084X
  • Type

    conf

  • DOI
    10.1109/ELINSL.1988.13870
  • Filename
    13870