DocumentCode :
2441478
Title :
Measures against electrostatic destruction of electronic devices at electronic equipment assembly shops
Author :
Saotome, Kiyotaka ; Matsuhashi, Kenji
Author_Institution :
Dept. of Quality Assurance, NEC Saitama Ltd., Japan
fYear :
1998
fDate :
6-8 Oct. 1998
Firstpage :
218
Lastpage :
223
Abstract :
With the recent rapid growth of the population of portable phone users, higher importance is being placed on product compactness, weight and lifetime. In the product development sector in particular, it is becoming more important to achieve further reduction both in size and weight through routine use of large scale integration (LSI) components and new mounting technologies. The need for continued size reduction has required the use of semiconductor devices with lower electrostatic potential endurance than previous designs. In the production environment, establishing clearer handling rules and precautionary measures against electrostatic discharge (ESD) is all the more imperative, without which the maker\´s corporate competitiveness would be greatly reduced. Thus, we implemented a project to improve the overall level of our precautionary measures against ESD. We incorporated the "issue of improvement of ESD problems" into our qualitative environment rearrangement activities for 1997, and carried out practical improvement activities including the initial planning, proposal and studies, and implementation of the measures in liaison with other related sections.
Keywords :
assembling; electrostatic discharge; integrated circuit design; integrated circuit packaging; integrated circuit reliability; large scale integration; materials handling; planning; product development; static electrification; ESD precautionary measures; LSI components; corporate competitiveness; electronic devices; electronic equipment assembly shops; electrostatic destruction; electrostatic discharge; electrostatic potential endurance; handling rules; large scale integration; mounting technologies; planning; portable phones; product compactness; product development; product lifetime; product weight; production environment; qualitative environment rearrangement activities; semiconductor devices; size reduction; weight reduction; Assembly; Electronic equipment; Electrostatic discharge; Electrostatic measurements; Footwear; Humans; Large scale integration; Production; Semiconductor devices; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium Proceedings, 1998
Conference_Location :
Reno, NV, USA
Print_ISBN :
1-878303-91-0
Type :
conf
DOI :
10.1109/EOSESD.1998.737041
Filename :
737041
Link To Document :
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