DocumentCode :
2450913
Title :
Modeling and simulation of phonon boundary scattering in PDE-based device simulators
Author :
Tornblad, O. ; Sverdrup, P.G. ; Yergeau, D. ; Yu, Z. ; Goodson, K.E. ; Dutton, R.W.
Author_Institution :
Center for Integrated Syst., Stanford Univ., CA, USA
fYear :
2000
fDate :
2000
Firstpage :
58
Lastpage :
61
Abstract :
In this work, the effect of phonon boundary scattering on the heat transfer in thin silicon layers and close to interfaces was investigated. The modeling is applicable to silicon-on-insulator (SOI) devices as well as to conventional bulk technology. From a linearized Boltzmann transport equation (BTE), anisotropic local thermal conductivities are derived. A separate expression is formulated for the case of a bulk device where only one interface is present. Anisotropy was implemented as a finite element-based operator into the PROPHET device simulator and a demonstration of the new electrothermal modeling was made for a conventional MOSFET. The anisotropic local thermal conductivities lead to a temperature increase ~30% higher at the gate oxide interface compared to conventional modeling
Keywords :
Boltzmann equation; MOSFET; finite element analysis; interface phenomena; partial differential equations; phonons; scattering; semiconductor device models; technology CAD (electronics); thermal analysis; thermal conductivity; MOSFET; PDE-based device simulators; PROPHET device simulator; SOI devices; Si; Si-SiO2; anisotropic local thermal conductivity; bulk device; electrothermal modeling; finite element-based operator; gate oxide interface temperature; heat transfer; interface heat transfer; linearized Boltzmann transport equation; modeling; phonon boundary scattering; silicon-on-insulator devices; simulation; thin silicon layers; Anisotropic magnetoresistance; Boltzmann equation; Electrothermal effects; Finite element methods; Heat transfer; MOSFET circuits; Phonons; Scattering; Silicon on insulator technology; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 2000. SISPAD 2000. 2000 International Conference on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-6279-9
Type :
conf
DOI :
10.1109/SISPAD.2000.871206
Filename :
871206
Link To Document :
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