DocumentCode :
2459759
Title :
Large-scale circuit placement: gap and promise
Author :
Cong, Jason ; Kong, Tim ; Shinnerl, Joseph R. ; Xie, Min ; Yuan, Xin
Author_Institution :
Dept. of Comput. Sci., UCLA, Los Angeles, CA, USA
fYear :
2003
fDate :
9-13 Nov. 2003
Firstpage :
883
Lastpage :
890
Abstract :
Placement is one of the most important steps in the RTL-to-GDSII synthesis process, as it directly defines the interconnects, which have become the bottleneck in circuit and system performance in deep submicron technologies. The placement problem has been studied extensively in the past 30 years. However, recent studies show that existing placement solutions are surprisingly far from optimal. The first part of this tutorial summarizes results from recent optimality and scalability studies of existing placement tools. These studies show that the results of leading placement tools from both industry and academia may be up to 50% to 150% away from optimal in total wirelength. If such a gap can be closed, the corresponding performance improvement will be equivalent to several technology-generation advancements. The second part of the tutorial highlights the recent progress on large-scale circuit placement, including techniques for wire-length minimization, routability optimization, and performance optimization.
Keywords :
circuit layout CAD; circuit optimisation; integrated circuit interconnections; integrated circuit layout; integrated circuit metallisation; RTL-to-GDSII synthesis process; circuit performance bottleneck; deep submicron technologies; large scale circuit placement; performance optimization; routability optimization; system performance bottleneck; wire-length minimization; Algorithm design and analysis; Circuit synthesis; Circuits and systems; Computer science; Design automation; Integrated circuit interconnections; Integrated circuit technology; Large-scale systems; Minimization; Scalability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Aided Design, 2003. ICCAD-2003. International Conference on
Conference_Location :
San Jose, CA, USA
Print_ISBN :
1-58113-762-1
Type :
conf
DOI :
10.1109/ICCAD.2003.159779
Filename :
1257912
Link To Document :
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