• DocumentCode
    2460294
  • Title

    The Development of Foot Orthotics Using Shape Memory Alloy for Preventing Falls

  • Author

    Shimizu, Yuki ; Kobayashi, Masanori

  • Author_Institution
    Biomed. Eng. Dept., Daido Univ., Nagoya, Japan
  • fYear
    2011
  • fDate
    24-26 Oct. 2011
  • Firstpage
    117
  • Lastpage
    120
  • Abstract
    Plantar arch has been considered to be important function in walking and to control the body balance. Many of elderly lose this function, tend to fall which to lost activities of daily life. Therefore we attempt to develop the foot orthotics for preventing falls using hyper elasticity with shape memory alloy (SMA). To evaluate orthotics function, the single-leg standing testing with eyes open using subjects was done. Measuring standing time, maximum amplitude of body, moving area of centroid were measured using video recording and stabilograph. Meanwhile, pinch force of toe was measured to ascertain whether flatfoot was reproduced by orthotics, because the study was reported that plantar muscle was weakened with aged. Test results showed that all date of orthotics was superior to flatfoot model. Although no significant difference was showed by test results in this study, this orthotics with SMA could be expected to be effective for falls prevention.
  • Keywords
    biomechanics; biomedical measurement; force measurement; geriatrics; mechanoception; muscle; orthotics; physiological models; shape memory effects; video recording; body balance control; centroid; elderly; fall prevention; flatfoot model; foot orthotics; hyperelasticity; maximum body amplitude; plantar arch; plantar muscle; shape memory alloy; single-leg standing testing; stabilograph; standing time; toe pinch force; video recording; walking; Area measurement; Foot; Force; Force measurement; Muscles; Orthotics; Time measurement; Hyper elasticity; Plantar arch; Shape memory alloy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bioinformatics and Bioengineering (BIBE), 2011 IEEE 11th International Conference on
  • Conference_Location
    Taichung
  • Print_ISBN
    978-1-61284-975-1
  • Type

    conf

  • DOI
    10.1109/BIBE.2011.25
  • Filename
    6089817