DocumentCode :
2462118
Title :
A laboratory approach to RF power technology for semiconductor manufacturing
Author :
Smith, Ross
Volume :
3
fYear :
1998
fDate :
4-7 Nov. 1998
Firstpage :
1352
Abstract :
Radio frequency power technology is an essential part of the fabrication of today´s modern semiconductors. It would be virtually impossible to construct a high density multilevel device without the benefits provided by the use of RF power. While a basic course can be taught from a text, a course which has an associated hands-on lab offers much more, i.e. the opportunity to study the behavior of the system and make actual measurements. More and more, industry is looking for technicians and engineers who not only have a theoretical background in the technology, but also a real grasp of the nuts and bolts mechanics of the equipment they use. The goal of our program is to provide industry with an entry-level equipment technician. If graduates are to be assigned to an area of a semiconductor lab such as etch or thin films, he or she will need to be very familiar with the RF subsystems that are an integral part of the equipment or ´tool´. While it is unlikely a school will have the actual equipment that a graduate will encounter in industry, a program which has a balance of academics and lab experience can provide excellent preparation for the student. The author looks at the methodology in two parts: first, the author discusses the academic material that needs to be covered before the laboratory experience can be worth while, and secondly, the laboratory work itself.
Keywords :
electronic engineering education; laboratories; semiconductor device manufacture; student experiments; RF power technology; academic material; entry-level equipment technician; etching; high density multilevel device; laboratory approach; laboratory experience; radio frequency power technology; semiconductor manufacturing; thin films; Chemicals; Hazards; Laboratories; Plasma applications; Plasma chemistry; Plasma materials processing; Radio frequency; Safety; Semiconductor device manufacture; Sputter etching;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Frontiers in Education Conference, 1998. FIE '98. 28th Annual
Conference_Location :
Tempe, AZ, USA
ISSN :
0190-5848
Print_ISBN :
0-7803-4762-5
Type :
conf
DOI :
10.1109/FIE.1998.738693
Filename :
738693
Link To Document :
بازگشت