DocumentCode
2467079
Title
Effects of gate length on the performance of a top gate silicon nanowire on insulator (SOI) transistor
Author
Bhowmick, Sishir ; Sajjad, Redwan Noor ; Khosru, Quazi D M
Author_Institution
Dept. of Electr. & Electron. Eng., Bangladesh Univ. of Eng. & Technol., Dhaka
fYear
2008
fDate
8-10 Dec. 2008
Firstpage
1
Lastpage
4
Abstract
The effects of gate length Lg on the performance of a top gate silicon nanowire on insulator transistor are studied using three dimensional quantum simulation. From the study it is found that the inverse subthreshold slope and on/off current ratio are very sensitive to gate length. Significant improvement in subthreshold slope and on/off current ratio can be achieved using relatively longer gate with thin gate oxide. This improvement in the subthreshold region is due to better control of channel potential with longer gate. As a result of that the tunneling current through the conduction band is significantly suppressed in the subthreshold regime and there is an improvement in the subthreshold slope and on/off current ratio. Performance metrics such as transconductance gm, intrinsic switching delay tauS and unity current gain frequency fT of the device are also calculated and it is found that the on state performance of the device degrades with longer gate as all three parameters degrade with increased gate length.
Keywords
nanoelectronics; nanowires; silicon-on-insulator; transistors; conduction band; gate length; intrinsic switching delay; inverse subthreshold slope; on-off current ratio; three dimensional quantum simulation; top gate silicon nanowire on insulator transistor; transconductance; tunneling current; unity current gain frequency; Boundary conditions; Degradation; Delay; Insulation; Measurement; Poisson equations; Schrodinger equation; Silicon on insulator technology; Transconductance; Tunneling; Silicon Nanowires (SiNWs); on state performance; subthreshold slope;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices and Solid-State Circuits, 2008. EDSSC 2008. IEEE International Conference on
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-2539-6
Electronic_ISBN
978-1-4244-2540-2
Type
conf
DOI
10.1109/EDSSC.2008.4760708
Filename
4760708
Link To Document