Title :
Detection of Localized Adhesive Failure of Metallization on Non-Conducting Substrates Using Electromagnetic Ultrasonic Generation
Author :
Imaino, W. ; Crawforth, L. ; Munce, A.C. ; Juliana, A.
Keywords :
Adhesives; Area measurement; Bonding; Circuit testing; Delamination; Impedance; Metallization; Pollution measurement; Pulse measurements; Substrates;
Conference_Titel :
IEEE 1986 Ultrasonics Symposium
Conference_Location :
Williamsburg, VA, USA
DOI :
10.1109/ULTSYM.1986.198900
