DocumentCode
2472936
Title
Prediction of resist non-uniformity caused by underlying pattern density and topology
Author
Kim, Jin-Young ; Son, Dong-Su ; Seo, Eun-Jung ; Soh, Young-Soo ; Bak, Heung-Jin ; Oh, Hye-Keun
Author_Institution
Hanyang Univ., Ansan, South Korea
fYear
2000
fDate
11-13 July 2000
Firstpage
98
Lastpage
99
Abstract
We developed a simulator that can predict spin coated resist thickness with different feature type, density and topology by using dimensionless parameter and liquid resist film thickness. The change of critical dimension with surrounding topology and pattern density is simulated for the non-uniform resist thickness.
Keywords
photoresists; semiconductor process modelling; spin coating; critical dimension; dimensionless parameter; liquid film; lithography process simulation; pattern density; resist thickness nonuniformity; spin coating; substrate topology; Coatings; Lithography; Navier-Stokes equations; Planarization; Resists; Semiconductor device modeling; Thickness control; Topology; Transistors; Ultra large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocesses and Nanotechnology Conference, 2000 International
Conference_Location
Tokyo, Japan
Print_ISBN
4-89114-004-6
Type
conf
DOI
10.1109/IMNC.2000.872641
Filename
872641
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