• DocumentCode
    247306
  • Title

    Performance Optimization of MEMS Capacitive Accelerometer

  • Author

    Kachhawa, P. ; Komaragiri, R.

  • Author_Institution
    Dept. of Electron. & Commun. Eng., Nat. Inst. of Technol. Calicut, Calicut, India
  • fYear
    2014
  • fDate
    12-13 Sept. 2014
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    MEMS Accelerometers are widely used as sensing element to measure acceleration, tilt, shock. Accelerometer measures acceleration of a device which is used as an input to some type of control systems and those control systems change their dynamic conditions according to measured acceleration. This paper presents a capacitive accelerometer composed of pure oxide stacking to avoid the initial residual stress when the device is taken out from the substrate providing better thermal stability resulting in more accuracy of device in more harsh conditions. Sensitivity is improved by using full bridge differential capacitive sensing packaged us-ing LTCC technology. Performance analysis of device is done by finite element analysis (FEA) tool Intellisuite® and further optimization is achieved by varying beam length and beam width with pure oxide stacking struc-ture and LTCC packaging.
  • Keywords
    acceleration measurement; accelerometers; attitude measurement; capacitive sensors; ceramic packaging; finite element analysis; internal stresses; microsensors; shock measurement; thermal stability; FEA; LTCC technology; MEMS capacitive accelerometer; acceleration measurement; control systems; dynamic conditions; finite element analysis; full bridge differential capacitive sensing packaging; performance optimization; pure oxide stacking; residual stress; shock measurement; thermal stability; tilt measurement; Acceleration; Accelerometers; Bridge circuits; Micromechanical devices; Sensitivity; Sensors; Thermal stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Devices, Circuits and Communications (ICDCCom), 2014 International Conference on
  • Conference_Location
    Ranchi
  • Type

    conf

  • DOI
    10.1109/ICDCCom.2014.7024738
  • Filename
    7024738