DocumentCode
2473485
Title
Plastic packaging technologies for low-cost optical modules
Author
Tsuji, S. ; Tatsuno, K.
Author_Institution
Central Res. Lab., Hitachi Ltd., Tokyo, Japan
Volume
2
fYear
1998
fDate
3-4 Dec 1998
Firstpage
333
Abstract
Summary form only given. Non-hermetic, plastic packaging technologies are almost mature for the production of low-cost optical modules. Production of optical modules at low cost is essential in furthering the evolution of optical access networks. Cost-effective plastic packaging technology that incorporates flip-chip mounting developed in the LSI field, is an answer for mass production of optical modules
Keywords
flip-chip devices; integrated optoelectronics; modules; photodiodes; plastic packaging; LSI field; flip-chip mounting; low cost; low-cost optical modules; mass production; non-hermetic plastic packaging technologies; optical access networks; optical modules; plastic packaging technologies; plastic packaging technology; Costs; Dark current; Diode lasers; Electrons; Optical fiber networks; Optical receivers; Optical sensors; Optical surface waves; Plastic packaging; Production;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society Annual Meeting, 1998. LEOS '98. IEEE
Conference_Location
Orlando, FL
Print_ISBN
0-7803-4947-4
Type
conf
DOI
10.1109/LEOS.1998.739636
Filename
739636
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