Title :
Fast full wave analysis of PCB via arrays with model-to-hardware correlation
Author :
Gu, Xiaoxiong ; Wu, Boping ; Baks, Christian ; Tsang, Leung
Author_Institution :
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
This paper applies a methodology based on a mostly-analytical Foldy-Lax full wave scattering model to analyze via arrays in a multilayered printed circuit board. We have demonstrated good model-to-hardware correlation up to 20 GHz by simulating and measuring 8times8 via arrays including 29 signal vias and 35 ground vias in a 18-layer test board. The required CPU in the 64-via case is 4 seconds which is more than four orders of magnitude faster than the market leading general-purpose 3D full wave solver.
Keywords :
circuit simulation; integrated circuit interconnections; printed circuits; 18-layer test board; 3D full wave solver; Foldy-Lax full wave scattering model; PCB via arrays; fast full wave analysis; ground vias; model-to-hardware correlation; multilayered printed circuit board; signal vias; time 4 s; Apertures; Dielectric substrates; Electromagnetic scattering; Electromagnetic waveguides; Electronics packaging; Equations; Integrated circuit interconnections; Magnetic separation; Mathematical model; Printed circuits;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on
Conference_Location :
Portland, OR
Print_ISBN :
978-1-4244-4447-2
Electronic_ISBN :
978-1-4244-5646-8
DOI :
10.1109/EPEPS.2009.5338448
