Status and trend of automotive power packaging

Author

Liang, Zhenxian

Author_Institution

Oak Ridge Nat. Lab., Knoxville, TN, USA

fYear

2012

fDate

3-7 June 2012

Firstpage

325

Lastpage

331

Abstract

Comprehensive requirements in aspects of cost, reliability, efficiency, form factor, weight, and volume for power electronics modules in modern electric drive vehicles have driven the development of automotive power packaging technology intensively. Innovation in materials, interconnections, and processing techniques is leading to enormous improvements in power modules. In this paper, the technical development of and trends in power module packaging are evaluated by examining technical details with examples of industrial products. The issues and development directions for future automotive power module packaging are also discussed.

Keywords

automotive electronics; electric drives; hybrid electric vehicles; interconnections; modules; power electronics; power semiconductor devices; semiconductor device packaging; semiconductor device reliability; automotive power module packaging; electric drive vehicles; form factor; hybrid electric vehicles; industrial products; interconnections; power electronics modules reliability; processing techniques; Automotive engineering; Cooling; Electrodes; Multichip modules; Substrates; Wires; electric drive; hybrid electric & electric vehicles; packaging; power module; power semiconductor;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Semiconductor Devices and ICs (ISPSD), 2012 24th International Symposium on

Conference_Location

Bruges

ISSN

1943-653X

Print_ISBN

978-1-4577-1594-5

Electronic_ISBN

1943-653X

Type

conf

DOI

10.1109/ISPSD.2012.6229088

Filename

6229088