DocumentCode :
2476471
Title :
Feedback control design for cluster tools with wafer residency time constraints
Author :
Kim, Chulhan ; Lee, Tae-Eog
Author_Institution :
Dept. of Ind. & Syst. Eng., KAIST, Daejeon, South Korea
fYear :
2012
fDate :
14-17 Oct. 2012
Firstpage :
3063
Lastpage :
3068
Abstract :
Cluster tools for semiconductor manufacturing have been studied widely in terms of transportation robot scheduling. Cluster tool systems are discrete event systems, and usually modeled in timed Petri nets and timed event graphs. Many efficient robot operation sequences such as the backward sequence and the swap sequence have been developed, but they do not guarantee efficiency under consideration of wafer residency time constraints for some process modules. In this paper, we propose a way to control cluster tools with wafer residency time constraints using the max-plus algebra and timed event graphs. Conditions to meet time constraints are developed, and we introduce a methodology to add feedback control arcs to timed event graph models of single-armed cluster tools with the backward sequence, and dual-armed cluster tools with the swap sequence. Bounded variation on processing times also considered as well as time constraints.
Keywords :
Petri nets; algebra; cluster tools; discrete event systems; feedback; graph theory; mobile robots; semiconductor technology; cluster tool; discrete event systems; feedback control design; max-plus algebra; robot operation sequence; semiconductor manufacturing; swap sequence; time constraint; timed Petri nets; timed event graph model; transportation robot scheduling; wafer residency time constraint; Algebra; Load modeling; Mathematical model; Robots; Semiconductor device modeling; Time factors; Transportation; cluster tools; feedback control; timed event graphs; wafer residency time constraints;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Systems, Man, and Cybernetics (SMC), 2012 IEEE International Conference on
Conference_Location :
Seoul
Print_ISBN :
978-1-4673-1713-9
Electronic_ISBN :
978-1-4673-1712-2
Type :
conf
DOI :
10.1109/ICSMC.2012.6378261
Filename :
6378261
Link To Document :
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