DocumentCode
2480931
Title
Practical metal loss implementation for a microstrip line structure using SIBC in FDTD simulation
Author
Takagi, E. ; Houshmand, B. ; Itoh, T.
Volume
3
fYear
1997
fDate
8-13 June 1997
Firstpage
1531
Abstract
Metal transmission loss of a microstrip line was calculated by FDTD simulation using surface impedance boundary condition (SIBC) technique. Calculated results were compared to measurement results. Proper SIBC implementation in FDTD simulation produced good results, even if coarse grids were used for a microstrip line structure.
Keywords
electric impedance; finite difference time-domain analysis; losses; microstrip lines; waveguide theory; FDTD simulation; SIBC; coarse grids; metal loss implementation; microstrip line; microstrip line structure; surface impedance boundary condition; Boundary conditions; Conductivity; Finite difference methods; Frequency; Microstrip; Propagation losses; Strips; Surface impedance; Time domain analysis; Wireless communication;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1997., IEEE MTT-S International
Conference_Location
Denver, CO, USA
ISSN
0149-645X
Print_ISBN
0-7803-3814-6
Type
conf
DOI
10.1109/MWSYM.1997.596627
Filename
596627
Link To Document