• DocumentCode
    2482004
  • Title

    A novel flex-rigid and soft-release ECoG array

  • Author

    Tolstosheeva, E. ; Gordillo-González, V. ; Hertzberg, T. ; Kempen, L. ; Michels, I. ; Kreiter, A. ; Lang, W.

  • Author_Institution
    IMSAS Inst., Univ. of Bremen, Bremen, Germany
  • fYear
    2011
  • fDate
    Aug. 30 2011-Sept. 3 2011
  • Firstpage
    2973
  • Lastpage
    2976
  • Abstract
    This article addresses a novel fabrication process for an electrocorticogram (ECoG) electrode array. It consists of three regions: a flexible recording area, a flexible cable, and a rigid field for soldering the connectors. The flexible components can adapt to the curved shape of the cerebral cortex. Furthermore, the entire structure is a free-standing membrane, attached by removable polyimide straps to its carrier substrate. This configuration allows for a high level of control during soldering, electrode characterization and sterilization, as well as a soft release of the array off its carrier just before implantation. The array contains 128 gold electrodes, each 300 nm thick, sandwiched between two 5 μm thick polyimide films. The measuring area of the device is a regular hexagon with a side length of 7.2 mm, designed for implantation on the primary visual cortex of a Rhesus monkey. The flexible cable is 4 cm long. The rigid soldering area was designed for 4×32 OMNETICS connectors. The line resistance from an electrode site to the corresponding electrical connector pin is 540 Ω.
  • Keywords
    bioelectric potentials; biomedical electrodes; brain; gold; neurophysiology; polymer films; soldering; ECoG electrode array; OMNETICS connectors; Rhesus monkey; carrier substrate; cerebral cortex; electrical connector pin; electrocorticogram; electrode characterization; electrode sterilization; flexible cable; flexible components; flexible recording area; free-standing membrane; gold electrode; novel flex-rigid ECoG array; polyimide films; polyimide straps; primary visual cortex; rigid soldering area; size 300 nm; size 5 mum to 4 cm; soft-release ECoG array; Arrays; Connectors; Electrodes; Polyimides; Silicon; Soldering; Electrodes; Electroencephalography;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, EMBC, 2011 Annual International Conference of the IEEE
  • Conference_Location
    Boston, MA
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-4121-1
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2011.6090816
  • Filename
    6090816