• DocumentCode
    2493549
  • Title

    Impedance Spectroscopy on Solid State Electrochemical Sensors and Devices: Potentials and Pitfalls

  • Author

    Lee, Jong-Sook

  • Author_Institution
    Chonnam Nat. Univ., Gwangju
  • fYear
    2006
  • fDate
    22-25 Oct. 2006
  • Firstpage
    263
  • Lastpage
    266
  • Abstract
    In this contribution recent exemplary applications of impedance spectroscopy in characterization of solid state electrochemical devices will be presented. Serial electrical and electrochemical processes, each modeled as a RC parallel element, can be most successfully distinguished in conventional impedance plane representation, where the associated capacitance values are different by orders of magnitude. In the presence of short-circuiting grain boundary phase in Mg-Zr-O-N specimens, micro-contact impedance spectroscopy is employed to extract the bulk crystal conductivity. Ionic conduction responsible for the leakage current in CaF2 thin films on Si substrates can be unambiguously revealed by modulus spectroscopy. A general transmission line model is applied to describe a model mixed ionic and electronic conductor Ag2S with semi-blocking electrode conditions.
  • Keywords
    electrochemical impedance spectroscopy; electrochemical sensors; equivalent circuits; grain boundaries; ionic conductivity; substrates; thin films; Ionic conduction; RC parallel element; bulk crystal conductivity; electrochemical processes; general transmission line model; impedance plane representation; impedance spectroscopy; leakage current; microcontact impedance spectroscopy; short-circuiting grain boundary phase; solid state electrochemical sensors; substrates; thin films; Capacitance; Conductivity; Electrochemical devices; Electrochemical impedance spectroscopy; Electrochemical processes; Grain boundaries; Leakage current; Semiconductor thin films; Sensor phenomena and characterization; Solid state circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2006. 5th IEEE Conference on
  • Conference_Location
    Daegu
  • ISSN
    1930-0395
  • Print_ISBN
    1-4244-0375-8
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2007.355770
  • Filename
    4178608