DocumentCode
2493948
Title
Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium
fYear
1996
fDate
14-16 Oct. 1996
Abstract
The following topics were dealt with: flip-chip developments; semiconductor manufacturing cycle time; packaging; integrated design and manufacture; cost modelling; high density substrates; environmentally-conscious manufacturing; assembly and reliability; manufacturing management; process modelling; process quality; and process control
Keywords
assembling; environmental factors; flip-chip devices; integrated circuit design; integrated circuit manufacture; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; process control; quality control; semiconductor process modelling; assembly; cost modelling; environmentally-conscious manufacturing; flip-chip developments; high density substrates; integrated design/manufacture; manufacturing management; packaging; process control; process modelling; process quality; reliability; semiconductor manufacturing cycle time;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT
Conference_Location
Austin, TX, USA
ISSN
1089-8190
Print_ISBN
0-7803-3642-9
Type
conf
DOI
10.1109/IEMT.1996.559673
Filename
559673
Link To Document