Title :
Low-power SoC design for Ligament Balance Measuring System in Total Knee Arthroplasty
Author :
Liu, Ming ; Chen, Hong ; Zhang, Xu ; Zhang, Chun ; Jiang, Hanjun ; Wang, Zhihua
Author_Institution :
Sch. of Electron. Eng., Tsinghua Univ., Beijing, China
fDate :
Aug. 30 2011-Sept. 3 2011
Abstract :
A design of a low-power wireless System-on-Chip (SoC) for the Ligament Balance Measuring System (LBMS) in Total Knee Arthroplasty (TKA) is presented in this paper. It includes a signal conditioning circuit that can support up to 15 force sensors, a 433MHz RF front-end for data transmission, an 8-bit low-power microprocessor, and a FIFO with a digital filter. Idle and wake-up modes are well designed to reduce the power consumption since the device should be used for the whole surgical procedure. Test results show that the signal conditioning circuit with 16-bit single line output can operate under a wide voltage range, which is from 1.2V to 3.6V. The minimal power consumption is 139μ.W@1.2V with a 200KHz clock. Experimental results demonstrated in static and body tests are given in the paper also. The chip will be used in an aided monitoring system for Total Knee Arthroplasty in the future work.
Keywords :
biomedical electronics; clocks; digital filters; force sensors; integrated circuit design; low-power electronics; measurement systems; mechanoception; microprocessor chips; patient monitoring; prosthetics; signal conditioning circuits; surgery; system-on-chip; 16-bit single line output; 8-bit low-power microprocessor; FIFO; RF front-end; TKA; data transmission; digital filter; force sensors; frequency 200 kHz; idle modes; ligament balance measuring system; low-power SoC design; low-power wireless system-on-chip; power consumption; signal conditioning circuit; total knee arthroplasty; voltage 1.2 V to 3.6 V; wake-up modes; whole surgical procedure; Force; Implants; Joints; Monitoring; Sensors; Surgery; System-on-a-chip; Electric Power Supplies; Equipment Design; Equipment Failure Analysis; Humans; Knee Prosthesis; Ligaments, Articular; Monitoring, Ambulatory; Stress, Mechanical; Telemetry;
Conference_Titel :
Engineering in Medicine and Biology Society, EMBC, 2011 Annual International Conference of the IEEE
Conference_Location :
Boston, MA
Print_ISBN :
978-1-4244-4121-1
Electronic_ISBN :
1557-170X
DOI :
10.1109/IEMBS.2011.6091449