• DocumentCode
    249561
  • Title

    Improving pore extraction in high resolution fingerprint images using spatial analysis

  • Author

    Teixeira, Raoni F. S. ; Leite, Neucimar J.

  • Author_Institution
    Inst. of Comput., Univ. of Campinas - UNICAMP, Campinas, Brazil
  • fYear
    2014
  • fDate
    27-30 Oct. 2014
  • Firstpage
    4962
  • Lastpage
    4966
  • Abstract
    Pore extraction appears to play an important role in high resolution partial fingerprint recognition and in applications involving large population or high security levels. In this paper, we introduce a novel pore extraction approach which takes into account a new relation concerning their spatial and photometric dependence. This relation is given locally by analyzing distinct pores according to their distance and contrast. We evaluate our approach on high resolution pore extraction database and in an application involving partial fingerprint alignment. The proposed segmentation has proved to be quite general, simple and can accurately extract fingerprint pores in real images with different ridge and valley widths. It is also very robust to noise and according to the considered experiments outperforms well-known state-of-art methods.
  • Keywords
    fingerprint identification; image resolution; image segmentation; distinct pore analysis; fingerprint pore extraction; high resolution fingerprint images; high resolution partial fingerprint recognition; high resolution pore extraction database; partial fingerprint alignment; photometric dependence; pore contrast; pore distance; ridge width; security; segmentation; spatial analysis; spatial dependence; valley width; Accuracy; Algorithm design and analysis; Bismuth; Feature extraction; Fingerprint recognition; Image resolution; Radio frequency; Pore extraction; biometrics; high-resolution fingerprint; partial fingerprints; pore detection;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Image Processing (ICIP), 2014 IEEE International Conference on
  • Conference_Location
    Paris
  • Type

    conf

  • DOI
    10.1109/ICIP.2014.7026005
  • Filename
    7026005