Title :
Session 5 Flip chip and interconnection
Author :
Hirofumi Nakajima ; Tomoshi Ohde
Author_Institution :
NEC Electronics Corp., Japan
Abstract :
Start of the above-titled section of the conference proceedings record.
Conference_Titel :
VLSI Packaging Workshop of Japan, 2008. VPWJ 2008. IEEE 9th
Conference_Location :
Kyoto
Print_ISBN :
978-1-4244-3498-5
DOI :
10.1109/VPWJ.2008.4762214
