High temperature deformation of high density interconnects and packages by moire interferometry/FEM hybrid method

Author

Zhu, Jiansen ; Zou, Daqing ; Dai, Fulong ; Liu, Sheng ; Guo, Yi-Fan

Author_Institution

Dept. of Mech. Eng., Wayne State Univ., Detroit, MI, USA

fYear

1996

fDate

14-16 Oct 1996

Firstpage

75

Lastpage

83

Abstract

In the current study, 1200 I/mm grating or 600 1/mm gratings are replicated at either 80°C or 160°C onto the cross sections of several high density area interconnects and packages. These packages include BGA, flip-chip, and glob-top packages. The specimens are measured at room temperature for the thermal deformation induced by the cooling process. The strain distributions inside the solder joints are analyzed by both the moire interferometry and experimental/FEM hybrid method. Warpage of the packaging systems was measured and the effects of the bonding, encapsulation, soldering, and geometry on the deformation are discussed

Keywords

cooling; deformation; displacement measurement; encapsulation; finite element analysis; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; light interferometry; moire fringes; soldering; 160 C; 80 C; BGA packages; bonding effects; cooling process; encapsulation effects; experimental/FEM hybrid method; flip-chip packages; glob-top packages; gratings; high density interconnects; high density packages; high temperature deformation; moire interferometry; solder joints; strain distributions; thermal deformation; warpage; Bonding; Capacitive sensors; Cooling; Encapsulation; Geometry; Gratings; Interferometry; Packaging; Soldering; Temperature measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-3642-9

Type

conf

DOI

10.1109/IEMT.1996.559686

Filename

559686