DocumentCode
249763
Title
Stereo reconstruction of semiregular meshes, and multiresolution analysis for automatic detection of dents on surfaces
Author
Peyrot, Jean-Luc ; Payan, Frederic ; Ruchaud, Natacha ; Antonini, Marc
Author_Institution
Lab. I3S, Univ. Nice, Nice, France
fYear
2014
fDate
27-30 Oct. 2014
Firstpage
5417
Lastpage
5421
Abstract
Our objective is to include in stereoscopic 3D acquisition systems new technologies to automatically detect deformations on aircraft fuselages. We propose in this paper a semiregular mesh reconstruction dedicated to stereoscopic scanners, combined to a multiresolution analysis tool that detects dents on smooth surfaces. The proposed technique for reconstruction is based on a coarse-to-fine approach, and creates semiregular meshes directly from the stereoscopic images. The output of our scanner is thus a structured mesh, by the way well suited for many applications unlike most of scanners that generate only point clouds. Local distances are then calculated between this semiregular mesh and a smooth version of it, in order to automatically detect dents on the scanned surface. The smooth version is obtained via a technique based on multiresolution analysis. Experimental results show the reliability of our contributions on scanned aircraft fuselages.
Keywords
aerospace components; aircraft; deformation; image reconstruction; image resolution; mechanical engineering computing; stereo image processing; automatic deformation detection; coarse-to-fine approach; dent detection; multiresolution analysis tool; scanned aircraft fuselages; semiregular mesh reconstruction; smooth surfaces; stereoscopic 3D acquisition systems; stereoscopic images; stereoscopic scanners; Computational modeling; Image reconstruction; Multiresolution analysis; Stereo image processing; Surface reconstruction; Surface waves; Three-dimensional displays; 3D reconstruction; Semiregular; acquisition; multiresolution analysis; stereoscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Image Processing (ICIP), 2014 IEEE International Conference on
Conference_Location
Paris
Type
conf
DOI
10.1109/ICIP.2014.7026096
Filename
7026096
Link To Document