DocumentCode
2498110
Title
Design and Fabrication of Non-silicon-based Piezoresistive MEMS Tactile Sensor
Author
Wisitsoraat, A. ; Patanasetagul, V. ; Tuantranont, A. ; Poonnikorn, N.
Author_Institution
Nat. Electron. & Comput. Technol. Center, Pathumthani
fYear
2006
fDate
22-25 Oct. 2006
Firstpage
1317
Lastpage
1320
Abstract
In this work, we develop a new non-silicon-based piezoresistive MEMS tactile sensor by a low-cost fabrication process. Prior to fabrication, the structure was designed and simulated by finite element simulation software to predict the device behaviors. The MEMS tactile sensor with a trampoline membrane structure has been fabricated by successive sputtering of Cr, Al, AlN, indium tin oxide (ITO), and Au layers through electroplated Ni micro-shadow masks over an 8 mm-thick photoresist sacrificial layer on a glass substrate. In addition, the gauge factor of the ITO piezoresistive material was studied as a function of sputtering parameter including oxygen flow rate and film thickness to optimize the sensitivity of the sensor. It was found that the 0.4 mm-thick ITO film deposited with no oxygen flow provide an optimum gauge factor of ~650. The fabricated tactile sensor has been tested for displacement and force sensing and a high sensitivity of 0.2 mV/muN has been achieved.
Keywords
finite element analysis; force sensors; membranes; microsensors; piezoresistance; piezoresistive devices; sputtering; tactile sensors; displacement sensing; electroplating; finite element simulation; force sensing; gauge factor; micro-shadow masks; photoresist sacrificial layer; piezoresistive MEMS tactile sensor; piezoresistive material; size 0.4 mm; sputtering; trampoline membrane structure; Biomembranes; Chromium; Fabrication; Finite element methods; Indium tin oxide; Micromechanical devices; Piezoresistance; Predictive models; Sputtering; Tactile sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2006. 5th IEEE Conference on
Conference_Location
Daegu
ISSN
1930-0395
Print_ISBN
1-4244-0375-8
Electronic_ISBN
1930-0395
Type
conf
DOI
10.1109/ICSENS.2007.355872
Filename
4178867
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