• DocumentCode
    2500461
  • Title

    Planarizing regrowth of InP using a low pressure hydride VPE system

  • Author

    Beccard, R. ; Willems, S. ; Dehe, A. ; Heime, K. ; Laube, G. ; Speier, P.

  • Author_Institution
    RWTH Aachen, Germany
  • fYear
    1993
  • fDate
    19-22 Apr 1993
  • Firstpage
    56
  • Lastpage
    59
  • Abstract
    The planarization of etched device structures is an important step in the fabrication of InP-based optoelectronic integrated circuits. The authors have demonstrated the suitability of the low pressure hydride vapor phase epitaxy (VPE) process for the planarizing regrowth of etched grooves. A good agreement was found for growth on unpatterned substrates with different surface orientations and selective growth in grooves. In both cases growth is mainly determined by thermodynamics and kinetics and less by mass transfer limitations. An excellent planarization behavior was found when planarizing trenches etched in exactly oriented (100) substrates. An effect of the mask on the growth rates of various planes in grooves can only be found for deep grooves with a small opening width
  • Keywords
    III-V semiconductors; etching; indium compounds; integrated optoelectronics; semiconductor growth; vapour phase epitaxial growth; InP; InP-based optoelectronic integrated circuits; SiO2; etched device structures; etched grooves; exactly oriented (100) substrates; fabrication; kinetics; low pressure hydride VPE system; mask; mass transfer limitations; planarization; planarizing regrowth; surface orientations; thermodynamics; trenches; unpatterned substrates; Chemicals; Epitaxial growth; Human computer interaction; Hydrogen; Indium phosphide; Optical device fabrication; Planarization; Shape measurement; Temperature; Wet etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials, 1993. Conference Proceedings., Fifth International Conference on
  • Conference_Location
    Paris
  • Print_ISBN
    0-7803-0993-6
  • Type

    conf

  • DOI
    10.1109/ICIPRM.1993.380711
  • Filename
    380711