TEM cell measurements of an active EMC test chip

Author

de Smedt, Ronald ; Criel, Steven ; Bonjean, Frans ; Spildooren, Guido ; Monier, Guy ; Demoulin, Bernard ; Baudet, Jacques

Author_Institution

Alcatel Bell Telephone, Antwerp, Belgium

Volume

2

fYear

2000

fDate

2000

Firstpage

903

Abstract

A TEM cell configuration is used to measure the emission effect of an active EMC test chip or of tracks connected to it. A number of parameters have a clear influence on the emission level: clock frequency, inverting 50% of the lines and, to a less extent, giving a relative delay to some lines (staggering). Varying the internal buffers shows the importance of simultaneous switching noise. The track emission is mainly due to H-field coupling, while the chip emission is due to both E- and H-field coupling. The above conclusions are in line with previous direct radiation measurement results

Keywords

delays; electromagnetic compatibility; electromagnetic coupling; electromagnetic interference; integrated circuit measurement; integrated circuit noise; integrated circuit testing; test facilities; E-field coupling; H-field coupling; TEM cell measurements; active EMC test chip; chip emission; clock frequency; emission effect measurement; internal buffers; radiation measurement results; relative delay; simultaneous switching noise; track emission; Antenna measurements; Crosstalk; Electromagnetic compatibility; Integrated circuit noise; Logic testing; Noise generators; Pollution measurement; Qualifications; Semiconductor device measurement; TEM cells;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2000. IEEE International Symposium on

Conference_Location

Washington, DC

Print_ISBN

0-7803-5677-2

Type

conf

DOI

10.1109/ISEMC.2000.874743

Filename

874743