Title :
High complexity PCB´s for enhanced SMT and bare chip assembly applications
Author :
Ehrler, Sylvia ; Mayer, Reinhard ; Olbrich, Walter ; Roesch, Michael
Author_Institution :
Hewlett-Packard GmbH, Boblingen, Germany
Abstract :
New build-up technologies are necessary to meet the demands of future PC-boards. In this paper the DYCOstrate and PERL technologies are presented which use plasma etching for hole generation. These technologies offer advantages such as higher routing density, layer count reduction and lower production cost. Process flows are explained and possible constructions and design rules are presented. Electrical performance and reliability investigations have also been considered
Keywords :
circuit reliability; printed circuit design; printed circuit manufacture; sputter etching; surface mount technology; DYCOstrate technology; PERL technology; SMT assembly applications; bare chip assembly applications; design rules; electrical performance; high complexity PCB; hole generation; plasma etching; reliability; Assembly; Consumer electronics; Costs; Etching; Integrated circuit interconnections; Plasma applications; Polyimides; Production; Substrates; Surface-mount technology;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3642-9
DOI :
10.1109/IEMT.1996.559718
